System for processing a workpiece

ABSTRACT

An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. An array of workpiece housings are contained within an enclosure. A robot moves workpieces into and out of the workpiece housings.

This Application is a Continuation of U.S. patent application Ser. No.09/041,901, filed Mar. 13, 1998 and now pending, and incorporated hereinby reference.

BACKGROUND OF THE INVENTION

The semiconductor manufacturing industry is constantly seeking toimprove the processes used to manufacture integrated circuits fromwafers. The improvements come in various forms but, generally, have oneor more objectives as the desired goal. The objectives of many of theseimproved processes include: 1) decreasing the amount of time required toprocess a wafer to form the desired integrated circuits; 2) increasingthe yield of usable integrated circuits per wafer by, for example,decreasing the likelihood of contamination of the wafer duringprocessing; 3) reducing the number of steps required to turn a waferinto the desired integrated circuits; and 4) reducing the cost ofprocessing the wafers into the desired integrated circuit by, forexample, reducing the costs associated with the chemicals required forthe processing

In the processing of wafers, it is often necessary to subject one ormore sides of the wafer to a fluid in either liquid, vapor or gaseousform. Such fluids are used to, for example, etch the wafer surface,clean the wafer surface, dry the wafer surface, passivate the wafersurface, deposit films on the wafer surface, etc. Control of thephysical parameters of the processing fluids, such as their temperature,molecular composition, dosing, etc., is often quite crucial to thesuccess of the processing operations. As such, the introduction of suchfluids to the surface of the wafer occurs in a controlled environment.Typically, such wafer processing occurs in what has commonly becomeknown as a reactor.

Various reactors have been known and used. These reactors typically havea rotor head assembly that supports the wafer. In addition tointroducing the wafer into the processing chamber, the rotor headassembly may be used to spin the wafer during introduction of theprocessing fluid onto the surface of the wafer, or after processing toremove the processing fluid.

During processing, the wafer is presented to the rotor head assembly bya robot in a clean environment in which a number of processing reactorsare present. The robot presents the wafer in an exposed state to therotor head assembly in an orientation in which the side of the waferthat is to be processed is face up. The rotor head assembly inverts thewafer and engages and seals with a cup for processing. As the wafer isprocessed, the wafer is oriented so that the side of the wafer beingprocessed is face down.

These types of reactors are useful for many of the fluid processingsteps employed in the production of an integrated circuit. However,there remains a need for more control and efficiency from the reactor.As such, a substantially new approach to processing and reactor designhas been undertaken which provides greater control of the fluidprocesses and provides for more advanced and improved processes.

SUMMARY OF THE INVENTION

An apparatus for processing a workpiece in a micro-environment is setforth. The apparatus includes a rotor motor and a workpiece housing. Theworkpiece housing is connected to be rotated by the rotor motor. Theworkpiece housing further defines a processing chamber where one or moreprocessing fluids are distributed across at least one face of theworkpiece by centrifugal force generated during rotation of the housing.

In one embodiment, the workpiece housing includes an upper chambermember and a lower chamber member joined to one another to form theprocessing chamber. The processing chamber preferably generally conformsto the shape of the workpiece and includes at least one fluid outlet ata peripheral region. At least one workpiece support is advantageouslyprovided to support a workpiece in the processing chamber in a positionto allow centrifugal distribution of a fluid supplied through an inletopening into the process chamber. The fluid may be distributed across atleast an upper face and/or lower face of the workpiece, when theworkpiece housing is rotated. The fluid outlet is positioned to allowextraction of fluid in the processing chamber by centrifugal force.

In a second aspect, an apparatus for processing a workpiece has aninput/output station, and several workpiece processing stationspositioned in an array. At least one of the workpiece processingstations includes a housing having a workpiece chamber in which one ormore process fluids are distributed across at least one face of theworkpiece by centrifugal force generated by rotation of the workpiece. Arobotic arm moves to carry a workpiece from the input/output station toat least one of the workpiece processing stations.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a workpiece housing and a rotorassembly constructed in accordance with one embodiment of the invention.

FIG. 2 is an exploded view of a further embodiment of a workpiecehousing constructed in accordance with the teachings of the presentinvention

FIG. 3 is a top plan view of the workpiece housing of FIG. 2 when thehousing is in an assembled state.

FIG. 4 is a cross-sectional view of the workpiece housing taken alongline IV—IV of FIG. 3.

FIG. 5 is a cross-sectional view of the workpiece housing taken alongline V—V of FIG. 3.

FIG. 6 is a cross-sectional view of the workpiece housing taken alongline VI—VI of FIG. 3.

FIGS. 7A and 7B are cross-sectional views showing the workpiece, housingin a closed state and connected to a rotary drive assembly.

FIGS. 8A and 8B are cross-sectional views showing the workpiece housingin an open state and connected to a rotary drive assembly.

FIG. 9 illustrates one embodiment of an edge configuration thatfacilitates mutually exclusive processing of the upper and lower wafersurfaces in the workpiece housing.

FIG. 10 illustrates an embodiment of the workpiece housing employed inconnection with a self-pumping re-circulation system.

FIGS. 11 and 12 are schematic diagrams of exemplary processing toolsthat employ the present invention.

FIG. 13 illustrates a batch wafer processing tool constructed inaccordance with the principles of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a cross-sectional view of one embodiment of a reactor, showngenerally at 10, constructed in accordance with the teachings of thepresent invention. The embodiment of the reactor 10 of FIG. 1 isgenerally comprised of a rotor portion 15 and a workpiece housing 20.The rotor portion 15 includes a plurality of support members 25 thatextend downwardly from the rotor portion 15 to engage the workpiecehousing 20. Each of the support members 25 includes a groove 30 that isdimensioned to engage a radially extending flange 35 that extends abouta peripheral region of the workpiece housing 20. Rotor portion 15further includes a rotor motor assembly 40 that is disposed to rotate ahub portion 45, including the support members 25, about a central axis47. Workpiece housing 20 is thus secured for co-rotation with hubportion 45 when support members 25 are engaged with flange 35. Otherconstructions of the rotor portion 15 and the engagement mechanism usedfor securement with the workpiece housing 20 may also be used.

The workpiece housing 20 of the embodiment of FIG. 1 defines asubstantially closed processing chamber 50. Preferably, thesubstantially closed processing chamber 50 is formed in the generalshape of the workpiece 55 and closely conforms with the surfaces of theworkpiece. The specific construction of FIG. 1 includes an upper chambermember 60 having an interior chamber face 65. The upper chamber member60 includes a centrally disposed fluid inlet opening 70 in the interiorchamber face 65. The specific construction also includes a lower chambermember 75 having, an interior chamber face 80. The lower chamber member75 has a centrally disposed fluid inlet opening 85 in the interiorchamber face 80. The upper chamber member 60 and the lower chambermember 75 engage one another to define the processing chamber 50. Theupper chamber member 60 includes sidewalls 90 that project downward fromthe interior chamber face 65. One or more outlets 100 are disposed atthe peripheral regions of the processing chamber 50 through thesidewalls 90 to allow fluid within the chamber 50 to exit therefromthrough centripetal acceleration that is generated when the housing 20is rotated about axis 47.

In the illustrated embodiment, the workpiece 55 is a generally circularwafer having upper and lower planar surfaces. As such, the processingchamber 50 is generally circular in plan view and the interior chamberfaces 65 and 80 are generally planar and parallel to the upper and lowerplanar surfaces of the workpiece 55. The spacing between the interiorchamber faces 65 and 80 and the upper and lower planar surfaces of theworkpiece 55 is generally quite small. Such spacing is preferablyminimized to provide substantial control of the physical properties of aprocessing fluid flowing through the interstitial regions.

The wafer 55 is spaced from the interior chamber face 80 by a pluralityof spacing members 105 extending from the interior chamber face 80.Preferably, a further set of spacing members 110 extend from theinterior chamber face 65 and are aligned with the spacing members 105 togrip the wafer 55 therebetween.

Fluid inlet openings 70 and 85 provide communication passageways throughwhich one or more processing fluids may enter the chamber 50 forprocessing the wafer surfaces. In the illustrated embodiment, processingfluids are delivered from above the wafer 55 to inlet 70 through a fluidsupply tube 115 having a fluid outlet nozzle 120 disposed proximateinlet 70. Fluid supply tube 115 extends centrally through the rotorportion 15 and is preferably concentric with the axis of rotation 47.Similarly, processing fluids are delivered from below the wafer 55 toinlet 85 through a fluid supply tube 125. Fluid supply tube 125terminates at a nozzle 130 disposed proximate inlet 85. Although nozzles120 and 130 terminate at a position that is spaced from their respectiveinlets, it will be recognized that tubes 115 and 125 may be extended sothat gaps 135 are not present. Rather, nozzles 120 and 130 or tubes 115and 125 may include rotating seal members that abut and seal with therespective upper and lower chamber members 60 and 75 in the regions ofthe inlets 70 and 85. In such instances, care should be exercised in thedesign of the rotating joint so as to minimize any contaminationresulting from the wear of any moving component.

During processing, one or more processing fluids are individually orconcurrently supplied through fluid supply tubes 115 and 125 and inlets70 and 85 for contact with the surfaces of the workpiece 55 in thechamber 50. Preferably, the housing 20 is rotated about axis 47 by therotor portion 15 during processing to generate a continuous flow of anyfluid within the chamber 50 across the surfaces of the workpiece 55through the action of centripetal acceleration. Processing fluidentering the inlet openings 70 and 85 are thus driven across theworkpiece surfaces in a direction radially outward from the center ofthe workpiece 55 to the exterior perimeter of the workpiece 55. At theexterior perimeter of the workpiece 55, any spent processing fluid isdirected to exit the chamber 50 through outlets 100 as a result of thecentripetal acceleration. Spent processing fluids may be accumulated ina cup reservoir disposed below and/or about the workpiece housing 20. Aswill be set forth below in an alternative embodiment, the peripheralregions of the workpiece housing 20 may be constructed to effectivelyseparate the processing fluids provided through inlet 70 from theprocessing fluids supplied through inlet 85 so that opposite surfaces ofwafer 55 are processed using different processing fluids. In such anarrangement, the processing fluids may be separately accumulated at theperipheral regions of the housing 20 for disposal or re-circulation.

In the embodiment of FIG. 1, the workpiece housing 20 may constitute asingle wafer pod that may be used to transport the workpiece 55 betweenvarious processing stations and/or tools. If transport of the housing 20between the processing stations and/or tools takes place in a clean roomenvironment, the various openings of the housing 20 need not be sealed.However, if such transport is to take place in an environment in whichwafer contaminants are present, sealing of the various housing openingsshould be effected. For example, inlets 70 and 85 may each be providedwith respective polymer diaphragms having slits disposed therethrough.The ends of fluid supply tubes 115 and 125 in such instances may eachterminate in a tracor structure that may be used to extend through theslit of the respective diaphragm and introduce the processing fluid intothe chamber 50. Such tracor/slitted diaphragm constructions are used inthe medical industry in intravenous supply devices. Selection of thepolymer material used for the diaphragms should take into considerationthe particular processing fluids that will be introduced therethrough.Similar sealing of the outlets 100 may be undertaken in which the tracorstructures are inserted into the diaphragms once the housing 20 is in aclean room environment.

Alternatively, the outlets 100 themselves may be constructed to allowfluids from the processing chamber to exit therethrough while inhibitingthe ability of fluids to proceed from the exterior of housing 20 intochamber 50. This effect may be achieved, for example, by constructingthe openings 100 as nozzles in which the fluid flow opening has a largerdiameter at the interior of chamber 50 than the diameter of the openingat the exterior of the housing 20. In a further construction, arotational valve member may be used in conjunction with the plurality ofoutlets 100. The valve member, such as a ring with openingscorresponding to the position of outlets 100, would be disposedproximate the opening 100 and would be rotated to seal with the outlets100 during transport. The valve member would be rotated to a position inwhich outlets 100 are open during processing. Inert gas, such asnitrogen, can be injected into the chamber 50 through supply tubes 115and 125 immediately prior to transport of the housing to a subsequenttool or processing station. Various other mechanisms for sealing theoutlets 100 and inlets 70 and 85 may also be employed.

FIG. 2 is a perspective view of a further reactor construction whereinthe reactor is disposed at a fixed processing station and can open andclose to facilitate insertion and extraction of the workpiece. Thereactor, shown generally at 200, is composed of separable upper andlower chamber members, 205 and 210, respectively. As in the priorembodiment, the upper chamber member 205 includes a generally planarchamber face 215 having a centrally disposed inlet 220. Although notshown in the view of FIG. 2, the lower chamber member 210 likewise has agenerally planar interior chamber face 225 having a central inlet 230disposed therethrough. The upper chamber member 205 includes adownwardly extending sidewall 235 that, for example, may be formed froma sealing polymer material or may be formed integrally with otherportions of member 205.

The upper and lower chamber members, 205 and 210, are separable from oneanother to accept a workpiece therebetween. With a workpiece disposedbetween them, the upper and lower chamber members, 205 and 210, movetoward one another to form a chamber in which the workpiece is supportedin a position in which it is spaced from the planar interior chamberfaces 215 and 225. In the embodiment of the reactor disclosed in FIGS.2-8B, the workpiece, such as a semiconductor wafer, is clamped in placebetween a plurality of support members 240 and corresponding spacingmembers 255 when the upper and lower chamber members are joined to formthe chamber (see FIG. 7B). Axial movement of the upper and lower chambermembers toward and away from each other is facilitated by a plurality offasteners 307, the construction of which will be described in furtherdetail below. Preferably, the plurality of fasteners 307 bias the upperand lower chambers to a closed position such as illustrated at FIG. 7A.

In the disclosed embodiment, the plurality of wafer support members 240extend about a peripheral region of the upper chamber member 205 atpositions that are radially exterior of the sidewall 235. The wafersupport members 240 are preferably disposed for linear movement alongrespective axes 245 to allow the support members 240 to clamp the waferagainst the spacing members 255 when the upper and lower chamber membersare in a closed position (see FIG. 7A), and to allow the support members240 to release the wafer from such clamping action when the upper andlower chamber members are separated (see FIG. 8A). Each support member240 includes a support arm 250 that extends radially toward the centerof the upper chamber member 205. An end portion of each arm 250 overliesa corresponding spacing member 255 that extends from the interiorchamber face 215. Preferably, the spacing members 255 are each in theform of a cone having a vertex terminating proximate the end of thesupport arm 250. Notches 295 are disposed at peripheral, portions of thelower chamber member 210 and engage rounded lower portions 300 of thewafer support members 240. When the lower chamber member 210 is urgedupward to the closed position, notches 295 engage end portions 300 ofthe support members 240 and drive them upward to secure the wafer 55between the arms 250 of the supports 240 and the corresponding spacingmembers 255. This closed state is illustrated in FIG. 5. In the closedposition, the notches 295 and corresponding notches 296 of the upperchamber member (see FIG. 2) provide a plurality of outlets at theperipheral regions of the reactor 200. Radial alignment of the arm 250of each support member 240 is maintained by a set pin 308 that extendsthrough lateral grooves 309 disposed through an upper portion of eachsupport member.

The construction of the fasteners 307 that allow the upper and lowerchamber members to be moved toward and away from one another isillustrated in FIGS. 2, 6 and 7B. As shown, the lower chamber member 210includes a plurality of hollow cylinders 270 that are fixed thereto andextend upward through corresponding apertures 275 at the peripheralregion of the upper chamber member 205 to form lower portions of eachfastener 307. Rods 280 extend into the hollow of the cylinders 270 andare secured to form an upper portion of each fastener 307. Together, therods 280 and cylinders 270 form the fasteners 307 that allow relativelinear movement between the upper and lower chamber members, 205 and210, along axis 283 between the open and closed position. Two flanges,285 and 290, are disposed at an upper portion of each rod 280. Flange285 functions as a stop member that limits the extent of separationbetween the upper and lower chamber members, 205 and 210, in the openposition. Flanges 290 provide a surface against which a biasing member,such as a spring (see FIG. 6) or the like, acts to bias the upper andlower chamber members, 205 and 210, to the closed position.

With reference to FIG. 6, the spring 303 or the like, has a first endthat is positioned within a circular groove 305 that extends about eachrespective fastener 307. A second end of each spring is disposed toengage flange 290 of the respective fastener 307 in a compressed statethereby causing the spring to generate a force that drives the fastener307 and the lower chamber member 210 upward into engagement with theupper chamber member 205.

The reactor 200 is designed to be rotated about a central axis duringprocessing of the workpiece. To this end, a centrally disposed shaft 260extends from an upper portion of the upper chamber member 205. As willbe illustrated in further detail below in FIGS. 7A-8B, the 365 shaft 260is connected to engage a rotary drive motor for rotational drive of thereactor 200. The shaft 260 is constructed to have a centrally disposedfluid passageway (see FIG. 4) through which a processing fluid may beprovided to inlet 220. Alternatively, the central passageway mayfunction as a conduit for a separate fluid inlet tube or the like.

As illustrated in FIGS. 3 and 4, a plurality of optional overflowpassageways 312 extend radially from a central portion of the upperchamber member 205. Shaft 260 terminates in a flared end portion 315having inlet notches 320 that provide fluid communication between theupper portion of processing chamber 310 and the overflow passageways312. The flared end 315 of the shaft 260 is secured with the upperchamber member 205 with, for example, a mounting plate 325. Mountingplate 325, in turn, is secured to the upper chamber member 205 with aplurality of fasteners 330 (FIG. 5). Overflow passages 312 allowprocessing fluid to exit the chamber 310 when the flow of fluid to thechamber 310 exceeds the fluid flow from the peripheral outlets of thechamber.

FIGS. 7A and 7B are cross-sectional views showing the reactor 200 in aclosed state and connected to a rotary drive assembly, shown generallyat 400, while FIGS. 8A and 8B are similar cross-sectional views showingthe reactor 200 in an opened state. As shown, shaft 260 extends upwardinto the rotary drive assembly 400. Shaft 260 is provided with thecomponents necessary to cooperate with a stator 405 to form a rotarydrive motor assembly 410.

As in the embodiment of FIG. 1, the upper and lower chamber members 205and 210 join to define the substantially closed processing chamber 310that, in the preferred embodiment, substantially conforms to the shapeof the workpiece 55. Preferably, the wafer 55 is supported within thechamber 310 in a position in which its upper and lower faces are spacedfrom the interior chamber faces 215 and 225. As described above, suchsupport is facilitated by the support members 240 and the spacingmembers 255 that clamp the peripheral edges of the wafer 55 therebetweenwhen the reactor 200 is in the closed position of FIGS. 7A and 7B.

It is in the closed state of FIGS. 7A and 7B that processing of thewafer 55 takes place. With the wafer secured within the processingchamber 310, processing fluid is provided through passageway 415 ofshaft 260 and inlet 220 into the interior of chamber 310. Similarly,processing fluid is also provided to the chamber 310 through aprocessing supply tube 125 that directs fluid flow through inlet 230. Asthe reactor 200 is rotated by the rotary drive motor assembly 410, anyprocessing fluid supplied through inlets 220 and 230 is driven acrossthe surfaces of the wafer 55 by forces generated through centripetalacceleration. Spent processing fluid exits the processing chamber 310from the outlets at the peripheral regions of the reactor 200 formed bynotches 295 and 296. Such outlets exist since the support members 240are not constructed to significantly obstruct the resulting fluid flow.Alternatively, or in addition, further outlets may be provided at theperipheral regions.

Once processing has been completed, the reactor 200 is opened to allowaccess to the wafer, such as shown in FIGS. 8A and 8B. After processing,actuator 425 is used to drive an actuating ring 430 downward intoengagement with upper portions of the fasteners 307. Fasteners 307 aredriven against the bias of spring 303 causing the lower chamber member210 to descend and separate from the upper chamber member 205. As thelower chamber member 210 is lowered, the support members 240 follow itunder the influence of gravity, or against the influence of a biasingmember, while concurrently lowering the wafer 55. In the lower position,the reactor chamber 310 is opened thereby exposing the wafer 55 forremoval and/or allowing a new wafer to be inserted into the reactor 200.Such insertion and extraction can take place either manually, or by anautomatic robot.

FIG. 9 illustrates an edge configuration that facilitates separateprocessing of each side of the wafer 55. As illustrated, a dividingmember 500 extends from the sidewall 235 of the processing chamber 310to a position immediately proximate the peripheral edge 505 of the wafer55. The dividing member 500 may take on a variety of shapes, theillustrated tapered shape being merely one configuration. The dividingmember 500 preferably extends about the entire circumference of thechamber 310. A first set of one or more outlets 510 is disposed abovethe dividing member 500 to receive spent processing fluid from the uppersurface of the wafer 55. Similarly, a second set of one or more outlets515 is disposed below the dividing member 500 to receive spentprocessing fluid from the lower surface of the wafer 55. When the wafer55 rotates during processing, the fluid through supply 415 is providedto the upper surface of the wafer 55 and spreads across the surfacethrough the action of centripetal acceleration. Similarly, the fluidfrom supply tube 125 is provided to the lower surface of the wafer 55and spreads across the surface through the action of centripetalacceleration. Because the edge of the dividing member 500 is so close tothe peripheral edge of the wafer 55, processing fluid from the uppersurface of the wafer 55 does not proceed below the dividing member 500,and processing fluid from the lower surface of the wafer 55 does notproceed above the dividing member 500. As such, this reactorconstruction makes it possible to concurrently process both the upperand lower surfaces of the wafer 55 in a mutually exclusive manner usingdifferent processing fluids and steps.

FIG. 9 also illustrates one manner in which the processing fluidssupplied to the upper and lower wafer surfaces may be collected in amutually exclusive manner. As shown, a fluid collector 520 is disposedabout the exterior periphery of the reactor 200. The fluid collector 520includes a first collection region 525 having a splatter stop 530 and afluid trench 535 that is structured to guide fluid flung from theoutlets 510 to a first drain 540 where the spent fluid from the upperwafer surface may be directed to a collection reservoir for disposal orre-circulation. The fluid collector 520 further includes a secondcollection region 550 having a further splatter stop 555 and a furtherfluid trench 560 that is structured to guide fluid flung from theoutlets 515 to a second drain 565 where the spent fluid from the lowerwafer surface may be directed to a collection reservoir for disposal orre-circulation.

FIG. 10 illustrates an embodiment of the reactor 200 having an alternateconfiguration for supplying processing fluid through the fluid inletopening 230. As shown, the workpiece housing 20 is disposed in a cup570. The cup 570 includes sidewalls 575 exterior to the outlets 100 tocollect fluid as it exits the chamber 310. An angled bottom surface 580directs the collected fluid to a sump 585. Fluid supply line 587 isconnected to provide an amount of fluid to the sump 585. The sump 585 isalso preferably provided with a drain valve 589. An inlet stem 592defines a channel 595 that includes a first end having an opening 597that opens to the sump 585 at one end thereof and a second end thatopens to the inlet opening 230.

In operation of the embodiment shown in FIG. 10, processing fluid isprovided through supply line 587 to the sump 585 while the reactor 200is spinning. Once the sump 585 is full, the fluid flow to the sumpthrough supply line 587 is eliminated. Centripetal accelerationresulting from the spinning of the reactor 200 provides a pressuredifferential that drives the fluid through openings 597 and 230, intochamber 310 to contact at least the lower surface of the wafer 55, andexit outlets 100 where the fluid is re-circulated to the sump 585 forfurther use.

There are numerous advantages to the self-pumping re-circulation systemillustrated in FIG. 10. The tight fluid loop minimizes lags in processparameter control thereby making it easier to control such physicalparameters as fluid temperature, fluid flow, etc. Further, there is noheat loss to plumbing, tank walls, pumps, etc. Still further, the systemdoes not use a separate pump, thereby eliminating pump failures whichare common when pumping hot, aggressive chemistries.

FIGS. 11 and 12 illustrate two different types of processing tools, eachof which may employ one or more processing stations including thereactor constructions described above. FIG. 11 is a schematic blockdiagram of a tool, shown generally at 600, including a plurality ofprocessing stations 605 disposed about an arcuate path 606. Theprocessing stations 605 may all perform similar processing operations onthe wafer, or may perform different but complementary processingoperations. For example, one or more of the processing stations 605 mayexecute an electrodeposition process of a metal, such as copper, on thewafer, while one or more of the other processing stations performcomplementary processes such as, for example, clean/dry processing,pre-wetting processes, photoresist processes, etc.

Wafers that are to be processed are supplied to the tool 600 at aninput/output station 607. The wafers may be supplied to the tool 600 in,for example, S.M.I.F. pods, each having a plurality of the wafersdisposed therein. Alternatively, the wafers may be presented to the tool600 in individual workpiece housings, such as at 20 of FIG. 1.

Each of the processing stations 605 may be accessed by a robotic arm610. The robotic arm 610 transports the workpiece housings, orindividual wafers, to and from the input/output station 607. The roboticarm 610 also transports the wafers or housings between the variousprocessing stations 605.

In the embodiment of FIG. 11, the robotic arm 610 rotates about axis 615to perform the transport operations along path 606. In contrast, thetool shown generally at 620 of the FIG. 12 utilizes one or more roboticarms 625 that travel along a linear path 630 to perform the requiredtransport operations. As in the embodiment of FIG. 10, a plurality ofindividual processing stations 605 are used, but more processingstations 605 may be provided in a single processing tool in thisarrangement.

FIG. 13 illustrates one manner of employing a plurality of workpiecehousings 700, such as those described above, in a batch processingapparatus 702. As shown, the workpiece housings 700 are stackedvertically with respect to one another and are attached for rotation bya common rotor motor 704 about a common rotation axis 706. The apparatus702 further includes a process fluid delivery system 708. The deliverysystem 708 includes a stationary manifold 710 that accepts processingfluid from a fluid supply (not shown). The stationary manifold 710 hasan outlet end connected to the input of a rotating manifold 712. Therotating manifold 712 is secured for co-rotation with the housings 700and, therefore, is connected to the stationary manifold 710 at arotating joint 714. A plurality of fluid supply lines 716 extend fromthe rotating manifold 712 and terminate at respective nozzle portions718 proximate inlets of the housings 700. Nozzle portions 718 that aredisposed between two housings 700 are constructed to provide fluidstreams that are directed in both the upward and downward directions. Incontrast, the lowermost supply line 716 includes a nozzle portion 718that directs a fluid stream only in the upward direction. The uppermostportion of the rotating manifold 712 includes an outlet 720 thatprovides processing fluid to the fluid inlet of the uppermost housing700.

The batch processing apparatus 702 of FIG. 13 is constructed toconcurrently supply the same fluid to both the upper and lower inlets ofeach housing 700. However, other configurations may also be employed.For example, nozzle portions 718 may include valve members thatselectively open and close depending on whether the fluid is to besupplied through the upper and/or lower inlets of each housing 700. Insuch instances, it may be desirable to employ an edge configuration,such as the one shown in FIG. 9, in each of the housings 700 to provideisolation of the fluids supplied to the upper and lower surfaces of thewafers 55. Still further, the apparatus 702 may include concentricmanifolds for supplying two different fluids concurrently to individualsupply lines respectively associated with the upper and lower inlets ofthe housings 700.

Numerous substantial benefits flow from the use of the disclosed reactorconfigurations. Many of these benefits arise directly from the reducedfluid flow areas in the reactor chambers. Generally, there is a moreefficient use of the processing fluid since very little of the fluidsare wasted. Further, it is often easier to control the physicalparameters of the fluid flow, such as temperature, mass flow, etc.,using the reduced fluid flow areas of the reactor chambers. This givesrise to more consistent results and makes those results repeatable.

The foregoing constructions also give rise to the ability to performsequential processing of a single wafer using two or more processingfluids sequentially provided through a single inlet of the reactionchamber. Still further, the ability to concurrently provide differentfluids to the upper and lower surfaces of the wafer opens theopportunity to implement novel processing operations. For example, aprocessing fluid, such as HF liquid, may be supplied to a lower fluidinlet of the reaction chamber for processing the lower wafer surfacewhile an inert fluid, such as nitrogen gas, may be provided to the upperfluid inlet. As such, the HF liquid is allowed to react with the lowersurface of the wafer while the upper surface of the wafer is effectivelyisolated from HF reactions. Numerous other novel processes may also beimplemented.

The present invention has been illustrated with respect to a wafer.However, it will be recognized that the present invention has a widerrange of applicability. By way of example, the present invention isapplicable in the processing of disks and heads, flat panel displays,microelectronic masks, and other devices requiring effective andcontrolled wet processing.

Numerous modifications may be made to the foregoing system withoutdeparting from the basic teachings thereof. Although the presentinvention has been described in substantial detail with reference to oneor more specific embodiments, those of skill in the art will recognizethat changes may be made thereto without departing from the scope andspirit of the invention as set forth in the appended claims.

What is claimed:
 1. An apparatus for processing a workpiece comprising:an input/output station; a plurality of workpiece processing stationspositioned in an array with at least one of the workpiece processingstations comprising: an upper chamber member and a lower chamber memberwith the upper chamber member moveable relative to the lower chambermember to form a processing chamber with the lower chamber member; aplurality of upper spacing members on the upper chamber member; aplurality of lower spacing members on the lower chamber member, whereinthe upper and lower spacing members position the workpiece between theupper and lower chamber members; a first inlet in one of the upperchamber member and the lower chamber member for providing a first fluidflow to a first surface of the workpiece; at least one fluid outlet inthe processing chamber positioned to allow escape of fluid from theprocessing chamber, by centrifugal force generated by rotating theprocessing chamber; and a robotic arm movable to carry a workpiece fromthe input/output station to at least one of the workpiece processingstations.
 2. The apparatus of claim 1 wherein the upper chamber memberand the lower chamber member are moveable into a first position, wherethey are spaced apart from each other, for loading or unloading aworkpiece into or out of the chamber by the robotic arm, and where theupper and lower chamber members are movable into a second position,where they are engaged together, for processing the workpiece.
 3. Theapparatus of claim 1 with the upper chamber member and the lower chambermember linearly movable together to form the processing chamber andlinearly movable apart for loading and unloading a workpiece.
 4. Theapparatus of claim 1 wherein the processing chamber is removable fromthe at least one workpiece processing station in the apparatus andplaceable into a second workpiece processing station in the apparatus.5. The apparatus of claim 1 wherein the processing chamber is removablefrom a first workpiece processing station in the apparatus, and movablevia the robotic arm to the input/output station for removal from theapparatus.
 6. The apparatus of claim 1 with the processing chamberformed with interstitial regions between the upper and lower surfaces ofthe workpiece and the upper and lower chamber members, to closelyconfine processing fluids introduced into the processing chamber aroundthe workpiece.
 7. The apparatus of claim 1 wherein the first inletextends through the upper chamber member and a second inlet extendsthrough the lower chamber member.
 8. The apparatus of claim 1 whereinthe upper and lower chamber members have flat and parallel interiorsurfaces.
 9. The apparatus of claim 1 wherein the first inlet isconnected to first fluid supply for supplying the first fluid flowacross substantially the entire upper surface of the workpiece, and asecond inlet is connected to a second fluid supply for supplying thesecond fluid flow across substantially the entire lower surface of theworkpiece.
 10. An apparatus for processing a workpiece comprising: aninput/output station; a plurality of workpiece processing stationspositioned in an array, with substantially all of the workpieceprocessing stations including: a first chamber member having a firstfluid inlet opening; a second chamber member, with the first chambermember moveable relative to the second chamber member to form aprocessing chamber with the second chamber member, the processingchamber having at least one fluid outlet positioned to allow escape offluid from the processing chamber by centrifugal force; at least oneworkpiece support adapted to support a workpiece in the processingchamber, in a position to allow distribution of a fluid supplied throughthe first fluid inlet across at least a first face of the workpiece, viacentrifugal force; a plurality of fasteners on the first chamber memberfor securing the first chamber member to the second chamber member forprocessing the workpiece; a robotic arm movable from the input/outputstation to the workpiece processing stations.
 11. The apparatus of claim10 wherein the workpiece is a generally circular semiconductor wafer andwherein the inlet openings of the first and second chamber members aregenerally aligned with the center of the semiconductor wafer.
 12. Theapparatus of claim 10 wherein the plurality of workpiece processingstations are positioned on an arcuate path.
 13. The apparatus of claim10 wherein the plurality of workpiece processing stations are positionedin first and second spaced apart columns, with the robotic arm movablebetween the first and second columns.
 14. The apparatus of claim 10 withthe first chamber member includes sidewalls extending towards the secondchamber member, and with the at least one fluid outlet extending throughthe sidewalls.
 15. The apparatus of claim 10 wherein at least one of theplurality of fasteners comprises a rod that is securable into a cylinderon the second chamber member for securing the first chamber member tothe second chamber member.
 16. The apparatus for processing a workpiececomprising: an enclosure; an input/output station; a plurality ofworkpiece processing stations within the enclosure with substantiallyeach one of the workpiece processing stations comprising: a first rotor;a second rotor moveable relative to the first rotor to form a chamberconforming to the shape of the workpiece; a plurality of first spacingmembers on the first rotor; a plurality of second spacing members on thesecond rotor, wherein the first and second spacing members position theworkpiece between the first and second chamber members; at least oneinlet in the chamber, for providing a fluid into the chamber, with theinlet having an opening diameter greater than a height of the chamberformed by the first and second rotors, when the first and second rotorsare engaged; at least one outlet in the chamber, for removing fluid fromthe chamber; and a robotic arm movable within the enclosure, movablebetween the workpiece processing stations and the input/output station.17. The apparatus of claim 16 wherein the robotic arm rotates about avertical axis to transport a workpiece.
 18. An apparatus for processinga workpiece comprising: an enclosure; a plurality of workpieceprocessing stations in two spaced apart and parallel columns within theenclosure; at least one of the workpiece processing stations comprisingan upper element engageable with a lower element to form a chamber inwhich one or more fluids is distributed across at least one face of theworkpiece by centrifugal force generated by rotation of the workpiece; aplurality of upper spacing members on the upper element; a plurality oflower spacing members on the lower element, wherein the upper and lowerspacing members position the workpiece between the upper and lowerelements; and at least one robotic arm within the enclosure and movablebetween the two columns of processing stations.
 19. The apparatus ofclaim 18 further including a second robotic arm between the first andsecond columns.